 |
|
|
| |
|
|
|
|
|
|
- (1)
- (1)
- (1)
- (1)
- (1)
- (1)
- (1)
- (1)
- (1)
- (1)
- (1)
|
|
| |
|
|
Build Your Online Product Catalogs?
Application
1.The material of this hot melt glue stick is thermoplastic resin.
2.It is used for the bonding of electronic components such as basilar panel, capacitances ,coil and coper,steal and aluminum .It could also be used for bonding ABS,PVC,PET and the similar plastic material.
Specification
1.Appearance White Stick 2.Diameter(mm) 11.2+0.5
3. Soften Point (Degrees centigrade) 140¡À10 Ring and Ball Method
4.Tesile strength(***) 60 ASTM D412-98A
5.Hardness 80 Shors(A/30 Degrees centigrade)
6.Drying time(second) 8-10 JISK-6730
7.Viscosity(160 Degrees ctntigrade CP) 16000¡À1500 Brookfied LVF
8.Viscosity(170Degrees ctntigrade CP) 12000¡À1500 Brookfied LVF
9.Viscosity(180 Degrees ctntigrade CP) 9000¡À1500 Brookfied LVF
Packing
20KG/CTN Or 25KG/CTN
|
| Company: |
zhongshan conor electronic technology co.,ltd
|
| Contact: |
Ms. crystal tam |
| Address: |
NO.31 Jiangling Road Daling Huoju Development Zone Zhongshan |
| Postcode: |
528454 |
| Tel: |
86-760-89965962 |
| Fax: |
86-760-86135765 |
| E-mail: |
|
|
|
Home
